Pogo Pin

Pogo pins are utilized for manufacturing pogo-type sockets for the packaged ICs test. The tip of the pogo pin is made into various types depending on the shape of the test object, such as balls and pads, and we supply the optimal pin type that meets the customer’s needs.

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Pogo Pin Tip Shape

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kv type : OS03VC-F5.3

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kv type : OS03VR-F10.1

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k type : OS03VA-F4.53

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k type : OS03VA-F3.4

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Barreless type : OD08CR-F4.0

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Barreless type : OD03CA-P5.85

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WAFER LEVEL TEST SOCKET

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

최소 pitch 0.08mm
하중: 3gf~ tgf
Socket 소재:엔지니어링 플라스틱과 세라믹
낮은 단가 제작 가능
뛰어난 내구성 (100만 사이클 이상)
빠른 납기일정:2주이내
접촉저항: 10mΩ to 100mΩ

LOGIC TEST SOCKET

Spring Force	Initial Force Recommended Stroke Full Stroke	2.5gf 0.70mm @ 15.5gf 0.90mm @ 19.0gf
Material Spec	Barrel Top Plunger Bottom Plunger Spring	PBT / Gold plated SK4 / Gold plated Becu / Gold plated SWP / Gold plated
Mechanical Spec	Pointing Accuracy Operating Temperature Spring Life Expectancy	± 50um -25°C ~ +125°C 200K <
Electrical Spec	DC Resistance (Avg) Current Rating Band Width Self Inductance Capacitance	<80mΩ 2 amps continuous -1 dB @ 18.11 GHz 0.93nH 0.52pF

* 항목이 많으면 좌우 스크롤이 가능합니다.

WAFER LEVEL TEST SOCKET

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

최소 pitch 0.08mm
하중: 3gf~ tgf
Socket 소재:엔지니어링 플라스틱과 세라믹
낮은 단가 제작 가능
뛰어난 내구성 (100만 사이클 이상)
빠른 납기일정:2주이내
접촉저항: 10mΩ to 100mΩ